Click here to purchase Published annually in May. This volume contains 93 standards.Volumes 10.01 and 10.02 include standards covering: Ceramic and Mica Products; Composite and Textile Materials; Flexible Sheet, Tape, and Tubing; Plates, Rods, and Molded Materials; Electric Heating Unit Insulation and Electrical Tests; Hook-Up and Magnet Wire Insulation; Insulating Papers; Insulated Wire and...
Click here to purchase This document defines the LPDDR4 standard, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a JEDEC compliant 16 bit per channel SDRAM device with either one or two channels. LPDDR4 dual channel device density ranges from 4 Gb through 32...
Click here to purchase This document defines new modes in a reference data model, in order to allow integration of thesemodes into urban multimodal travel services (e.g. trip planning systems).Cross References:EN 12896-1:2016EN 12896-3EN 12896-2CEN/TR 17143EN 12896-4CEN/TS 16614-1ISO 20524-2EN 12896-5All current amendments available at time of purchase are included with the purchase of this...
Click here to purchase This document provides a guideline for the selection of a proper grout material to repair water leakage through cracks and other deformities in concrete structures. The factors relevant to the quality control of maintenance and repair of water-leakage cracks are as the following;a) conditions of water-leakage cracks;b) performance requirements for repair materials;c)...
Click here to purchase This document specifies the information exchanges between various parties' infrastructures that takeplace in support of DPM applications. It complements standards that address the design, security,applications and readability of Digital Postage Marks.Cross References:ISO 10126-2ISO/IEC 9798-3IEEE P1363-1998ANSI X9.30-1-1997 ANSI X9.31: 1998EN 14615ISO/IEC 10118-3FIPS PUB...
Click here to purchase This part of IEC TS 62607, which is a Technical Specification, specifies sample structures for evaluating a wide range of charge carrier concentration in organic/nano materials. This specification is provided for both capacitance-voltage (C-V) measurements in metal/insulator/semiconductor stacking structures and Hall-effect measurements with the van der Pauw configuration....